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High Temperature Resistant Material PUR Piezo Valve with Luer Connector for Dispensing System

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High Temperature Resistant Material PUR Piezo Valve with Luer Connector for Dispensing System

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Brand Name : HSTECH

Model Number : HS-YD-PUR300CC

Certification : CE

Place of Origin : China

MOQ : 1 PC

Price : Negotiable

Payment Terms : T/T, Western Union, MoneyGram

Supply Ability : 100 sets per week

Delivery Time : 7~9 work days

Packaging Details : Carton package

Product Name : PUR Piezo Valve

Application : Bonding And Sealing Of Cell Phone Shells

Weight : 15Kg

Material In Contact With Fluid : Stainless Steel 303, Special Steel

Fluid Inlet Size : Luer Connector

Applicable Viscosity Range : 0-20000cps

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High Temperature Resistant Material PUR Piezo Valve with Luer Connector​

Principle & Control

PUR Piezo Valve

  1. The PUR Piezo valve comprises a barrel heating module, a pressurized cap module, a nozzle heating module, a runner module, a valve body module, and a heat dissipation module.
  2. The barrel heating module supports the barrel and includes a controllable heating section to accomplish the initial warming of the gel.
  3. The pressurized cap module ensures the barrel is sealed and pressurized, managing the output pressure via a controller.
  4. The heat dissipation module functions to dissipate heat and minimize noise generated by the valve body.
  5. The Piezo-electric injection valve employs a modular design, with the gel-contacting section as the runner module and the non-contacting section as the valve body module.
  6. Depending on the application, the runner module can be swapped out to align with specific dispensing requirements.
  7. Nozzle diameters range from 0.03MM to 0.80MM, available in flat jet, needle, and extension styles.
  8. Runner modules require routine cleaning in an ultrasonic cleaner. Avoid immersing seals in organic solvents. Utilize specialized tools for nozzle cleaning to prevent damage.

Piezo Valve Controller

  1. The touch screen operates the piezoelectric injection valve and dispensing system, supporting 485 communication for robust, safe, and reliable control.

  2. The touch screen utilizes a graphical control interface, displaying the components of the dispensing system and control functions in a clear and intuitive manner.

  3. Nozzle Heating Device: Prior to dispensing, the nozzle must be heated to an appropriate temperature. The heating device employs a single-stage heating mode for this purpose.

  4. Maintaining a constant temperature at the nozzle ensures optimal gel performance by preserving its best qualities.

Nozzle and drum heating

  1. Before glue dispensing, the nozzles must be heated to an appropriate temperature using a two-stage heating process.

  2. By heating both the barrel and the nozzle, a consistent temperature is maintained for the glue, ensuring its optimal performance.

Specification

Model HS-YD-PUR30CC HS-YD-PUR300CC
Size (L*W*H) 120mm*50mm*140mm See attached drawing
Weight 0.75kg 1500g
Material in contact with fluid Stainless steel 303, special steel Stainless steel 303, special steel
Fluid inlet size Luer connector Luer connector
Needle assembly Tungsten steel wear-resistant material Φ0.6-Φ3.0mm Tungsten steel wear-resistant material Φ0.6-Φ2.1mm
Nozzle assembly Tungsten steel wear-resistant material Φ0.03~0.8mm Tungsten steel wear-resistant material Φ0.05~0.3mm
Heating assembly 20~220℃ 20~220℃
Fluid seals High temperature resistant material High temperature resistant material
Maintenance intervals for seal assemblies 20,000,000 times 20,000,000 times
Maximum dispensing frequency 1000Hz (Instantaneous maximum frequency 1500Hz) 1000Hz (Instantaneous maximum frequency 1500Hz)
Maximum drive power 100% 100%
Type of glue used PUR hot melt adhesive 300CC aluminum cylinder packaging PUR hot melt adhesive 300CC aluminum cylinder packaging
Applicable viscosity range 0-20000cps 0-20000cps
Fluid temperature range 80~220℃ 20~220℃

Product Features and Advantages

  1. Tube heating is ideal for 300CC aluminum tubes containing special hot melt glue.
  2. Featuring a modular design, parts are easy to replace, debugging is straightforward, and it boasts a broader range of application processes.
  3. The spraying volume can achieve precision down to 0.3nL, with a glue point consistency accuracy as high as 98%.
  4. It is capable of achieving a minimum line width of 0.17mm and a minimum spot diameter of 0.15mm in the hot melt adhesive spraying process.
  5. It is compatible with any motion platform available on the market.

Application Field

Bonding and sealing tasks include those for cell phone shells, encapsulation of new energy batteries, adhering and sealing contact screens for various electronic devices, encapsulating cell phone speakers and receivers, enclosing high-end headphones and audio casings, and encapsulating fingerprint recognition modules.


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